Yansong Yang is currently an Assistant Professor in the Department of Electronic and Computer Engineering at The Hong Kong University of Science and Technology, where he founded the Radio Frequency Microsystem (RFMY) Lab. His lab focuses on multi-physics microsystem technologies that integrate electrical, mechanical, and acoustic domains to enable single-chip platforms for signal processing, sensing, and computation, as well as AI-driven design and manufacturing of next-generation ultrasonic and radio-frequency microelectromechanical systems (ultrasonic/RF MEMS).

He has been awarded the 2023 Early Career Award from the IEEE Electron Devices Society (EDS) and the 2025 IEEE Ultrasonics Early Career Investigator Award from the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC). He has received the 2nd Place Best Paper Award at the 2018 IEEE International Microwave Symposium and the Best Paper Award at the 2019 & 2025 IEEE International Ultrasonics Symposium. He was also a finalist for the Best Paper Award at the 2018 IEEE International Frequency Control Symposium and the Advanced Practices Paper Competition Award at the 2020 IEEE International Microwave Symposium. Additionally, he received the 2019 P. D. Coleman Graduate Research Award from the University of Illinois at Urbana-Champaign (UIUC) and the 2022 Microwave Prize from the IEEE Microwave Theory and Techniques Society (MTT-S).

He is currently serving as the Technical Committee Chair for Microelectromechanical Systems in IEEE EDS, a Technical Committee Member for RF MEMS and Microwave Acoustics in IEEE MTT-S, and a Technical Committee Member for the IEEE International Conference on Micro Electro Mechanical Systems. Additionally, he serves as an Editor for IEEE Transactions on Electron Devices and an Associate Editor for IEEE Electron Devices Magazine.